While Allegro Package Designer Plus together with SiP Layout Option is and continues to be one of the most complete solutions for package design, Virtuoso RF Solution allows module layout authoring capabilities inside the Virtuoso System Design Platform. The Virtuoso RF Solution offers a powerful suite of IC and package co-design capabilities, such as Edit-In-Concert, cross-fabric net probing, and bump optimization. Virtuoso RF Solution co-design environment reduces the design cycle and eliminates error prone manual steps to align an IC with a package. If you are co-designing the package and IC, you might want to use both the Allegro and Virtuoso platforms to complete their design.(read more)
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